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HUAWEI PURA 70 PRO PLUS

HUAWEI

HUAWEI PURA 70 PRO PLUS

VERSI
Diumumkan

April 2024

Tanggal rilis

April 2024

JARINGAN
Teknologi

5G

PERANGKAT
Dimensi

162.6 x 75.1 x 8.4 mm (6.40 x 2.96 x 0.33 di dalam)

Berat

220 (G7.76 oz)

Kartu SIM

Desain

13MP

Lainnya

IP68 tahan debu/air

LAYAR
langfront.Type

LTPO OLED,1B warna,HDR,120Hz,

Ukuran

6.8 inci

Resolusi

1260 x 2844 piksel

Perlindungan

Kunlun Glass

PLATFORM
Sistem operasi

HarmonyOS 4.2

Chipset

Kirin 9010 (7 nm)

Prosesor

Octa-core (1x2.3 GHz Taishan Big & 3x2.18 GHz Taishan Mid & 4x1.55 GHz Cortex-A510)

GPU

MEMORI
Slot kartu

Internal & RAM

512GB 16GB RAM or 1TB 16GB RAM

KAMERA
Utama

50 MP (f/1.4-f/4.0) (Laser Auto Focus)(Optical Image Stabilization) + 48 MP (3.5x optical zoom) + 12.5 MP (ultrawide)

SUARA
Loudspeaker

Yes, with stereo speakers

Jack 3,5 mm

KONEKTIVITAS
Wifi

pita ganda,Wi-Fi Langsung,

Bluetooth

5.2

GPS

✔️

NFC

✔️

Radio

USB

USB Type-C 3.1, DisplayPort 1.2

KARAKTERISTIK
Sensor

Fingerprint (under display, optical), accelerometer, proximity, gyro, compass, color spectrum, BDS Satellite Calling and Message

Berbagai

Fast Charging 100W, Fast wireless charging 80W, Reverse wireless charging 20W, Reverse wired charging 18W

BATERAI
Tipe

5050 mAh